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Guidance for testing and diagnostics of polymer insulators with respect to water induced corona
00.00 Proposal for new project received
Composite pin insulators for distribution lines
00.00 Proposal for new project received
IEC 61643-371, Performance Requirements and Test Methods for Hybrid Integrated Circuits Containing a Gas Discharge Tube (GDT) and a Metal-Oxide Varistor (MOV)
00.00 Proposal for new project received
IEC 61643-372, Selection and Application Principles for Hybrid Integrated Circuits Containing a Gas Discharge Tube (GDT) and a Metal-Oxide Varistor (MOV)
00.00 Proposal for new project received
Requirements of Instrument Transformers for travelling waves applications
00.00 Proposal for new project received
Requirements of Instrument Transformers for PMU applications
00.00 Proposal for new project received
Survey of graphical symbols for use on equipment standardised by Product Committee but not registered in IEC 60417
00.00 Proposal for new project received
Hydraulic Machines - Technical Specification for Pressure Fluctuation Transposition - Part 3：Reversible Pump-turbine
00.00 Proposal for new project received
IEC 62783-1-3 Ed 1.0: Twinax cables for digital communications - Part 1-3: Time-domain test methods for Twinax cables for digital communications, Propagation delay, intra-pair skew and inter-pair skew
00.00 Proposal for new project received
IEC 62783-3 ED1: Family specification - Cable for SAS physical interfaces
00.00 Proposal for new project received
Specification of a TD measurement method for twin-axial cables
00.00 Proposal for new project received
Model creation method using a measurement data of semiconductor device
00.00 Proposal for new project received
IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates
00.00 Proposal for new project received
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