IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
PUBLISHED SSH EN 61190-1-2:2007 60.60
Standard published Jul 17, 2012
Related project
Adopted from
EN 61190-1-2:2007
Adopted from
IEC 61190-1-2 Ed. 2.0 b
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