IEC 60749-30:2005 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Publication date: Aug 10, 2011

General information

Current stage: 99.60 Effective date: Aug 17, 2020

Next stage: WPUB

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French

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Status: Revised

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Scope

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Life cycle

PREVIOUSLY

Replaces
IEC PAS 62182:2000 ED1

NOW

IEC 60749-30:2005 ED1
99.60 Withdrawal effective
Aug 17, 2020

CORRIGENDA / AMENDMENTS

Amended by
IEC 60749-30:2005/AMD1:2011 ED1

REVISED BY

PUBLISHED
IEC 60749-30:2020 ED2

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