ISO 9455-5:2020

Soft soldering fluxes — Test methods — Part 5: Copper mirror test

Publication date: Oct 2, 2020

General information

Current stage: 60.60 Effective date: Oct 2, 2020

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Languages: English French

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Status: Published

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Scope

This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper.
The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

PREVIOUSLY

Revises
ISO 9455-5:2014

NOW

PUBLISHED
ISO 9455-5:2020
60.60 Standard published
Oct 2, 2020

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