ISO 9455-17:2024

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

Publication date: Jan 10, 2024

General information

Current stage: 60.60 Effective date: Jan 10, 2024

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Languages: English French

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Status: Published

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Scope

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

Life cycle

PREVIOUSLY

Revises
ISO 9455-17:2002

NOW

PUBLISHED
ISO 9455-17:2024
60.60 Standard published
Jan 10, 2024

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