ISO 9455-5:2014

Soft soldering fluxes — Test methods — Part 5: Copper mirror test

95.99 Withdrawal of Standard 2 tet 2020

General information

Current stage: 95.99 Effective date: 2 tet 2020

Originator: ISO

Owner: ISO/TC 44/SC 12

Type: International Standard

ICS: 25.160.50

Scope

ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

PREVIOUSLY

Revises
ISO 9455-5:1992

NOW

WITHDRAWN
ISO 9455-5:2014
95.99 Withdrawal of Standard
2 tet 2020

REVISED BY

PUBLISHED
ISO 9455-5:2020

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